Durable Carbon Reinforced Conductive Waffle Pack Trays For Automated Tool Handling
The waffle pack chip tray is engineered with a core focus on extreme durability, resistance to handling stress, and compatibility with automated tool interfaces. Recognizing that trays in high-volume production cycles face repeated loading, unloading, and shipping, this product integrates advanced materials to ensure maximum lifespan and minimal process interruption. The tray is molded using a high-quality, carbon-fiber reinforced conductive polymer. The carbon reinforcement is not merely for ESD; it provides extraordinary mechanical strength and anti-warping characteristics, guaranteeing that the tray maintains its critical flatness and dimensional alignment throughout its service life, even under rough handling or high stacking loads. Available in both the standard 2×2 and 4×4 inch formats, the tray's permanent ESD-safe properties ensure that sensitive microelectronic devices, such as bare die, COG (Chip-on-Glass), and CSPs, are consistently protected from static discharge.
Features:
- Carbon-Fiber Reinforced Strength
- Permanent ESD Safety
- Optimized for Tool Interface
- High Stacking and Shipping Security
- Versatile Material Options (ABS/PC)
Technical Parameters:
| HN24236 Technical Data Ref. |
| Base Information |
Material |
Color |
Matrix QTY |
Pocket Size |
| PC |
Black |
30*30=900PCS |
1.96*1.38*0.45mm |
| Size |
Length * Width * Height (according to customer's requirement) |
| Feature |
Durable; Reusable; Rcofriendly; Biodegradable |
| Sample |
A. Free Samples – Selected from e×isting products. |
| B. Customized Samples – Produced according to your design or requirements. |
| Accessory |
Cover/Lid, Clip/Clamp, Tyvek paper |
| Artowrk Format |
PDF,2D,3D |
Applications:
This ultra-durable waffle pack excels in high-throughput, high-stress microelectronic environments. Its key applications are concentrated where mechanical robustness and reliable automation interface are paramount. These include: High-Volume Bare Die Sorting and Kitting, where the trays are repeatedly loaded and fed into automated handlers; Secure Overseas Transport, utilizing the carbon-fiber strength to withstand stacking pressures and rough handling during shipping; Packaging for Large COG Devices, providing stable support for physically larger components; and Manufacturing Test Lines, ensuring consistent alignment for electrical probe testing and visual inspection. While often used for semiconductors, its reliable operation and superior device protection extend its use to other industries managing small, high-value inventory, such as high-precision medical parts or specialized watch mechanisms, providing a reliable method for inventory management and safeguarding during transit.
Customization:
Customization services focus heavily on reinforcing durability and optimizing the tray for your specific automated process. We offer: Enhanced Pocket Geometry, where the pocket walls can be thickened or reinforced at critical stress points, or feature specific clearance cuts to improve automated tool suction and release; Material Specificity, allowing the choice of specific polymer grades for enhanced impact resistance or chemical compatibility; Custom Marking, fiducial marks to aid machine vision and inventory tracking; and Bakeable Versions, for customers whose durable trays must also withstand thermal processing up to 180°C.
