Stackable High Temperature ESD Safe 4 Inch Waffle Pack Trays With Optimized Pockets
This is the larger format solution in the Waffle Pack series, a robust 4-inch square chip tray specifically engineered for demanding microelectronic applications requiring thermal stability and enhanced structural integrity. Unlike the smaller, general-purpose 4- inch trays, this product is designed for larger component arrays and processes involving elevated temperatures, such as thermal testing or baking environments. The construction utilizes a premium, carbon-fiber reinforced, ESD-safe polymer. The carbon-fiber integration is critical, providing exceptional mechanical strength to the tray, making it highly resistant to warping, and ensuring permanent, non-sloughing electrostatic protection. This combination of durability and ESD safety is paramount when handling sensitive, high-value components over prolonged periods, especially in automated systems. The design incorporates a regular matrix of pockets, the geometry of which can be customized to securely support the components, which may include larger bare die or COG (Chip-on-Glass) devices. Furthermore, the tray’s flat and stable size, achieved through advanced injection molding and Moldflow analysis, makes it a reliable interface for automation equipment. This 4- inch tray is the preferred choice for pilot production setups and engineering lines where process stability and high-heat resistance are non-negotiable requirements for component handling and transport.
Features:
- Large 4-Inch Standard Format
- Exceptional High-Temperature Capability
- Carbon-Fiber Reinforced Construction
- Automation-Optimized Design
- Stackable with Clip System Compatibility
- Custom Pocket Optimization for Automation
Technical Parameters:
| HN24231 Technical Data Ref. |
| Base Information |
Material |
Color |
Matrix QTY |
Pocket Size |
| PC |
Black |
11*15=165PCS |
2.1*0.7*0.55mm |
| Size |
Length * Width * Height (according to customer's requirement) |
| Feature |
Durable; Reusable; Rcofriendly; Biodegradable |
| Sample |
A. Free Samples – Selected from e×isting products. |
| B. Customized Samples – Produced according to your design or requirements. |
| Accessory |
Cover/Lid, Clip/Clamp, Tyvek paper |
| Artowrk Format |
PDF,2D,3D |
Applications:
This 4-inch high-temperature waffle pack is specifically designed for integration into more rigorous back-end and testing processes. Its main applications center on environments requiring precise thermal management and component stability. These include: Thermal Testing and Burn-in; Automated Component Sorting; Packaging of Optoelectronic Devices
Customization:
Our commitment to customization ensures that your specific component requirements are met with precision. Beyond the standard 4-inch size, we offer complete control over the pocket matrix. Custom pocket geometries can be engineered to match the exact profile of your device, providing features like specialized peripheral support to prevent damage to fragile edges or integrated reference marks and fiducials to improve alignment for machine vision systems. Material choices are extensive: select from various conductive, antistatic, or permanently ESD-safe resins (e.g., Conductive ABS and PC).
