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Precision Jedec Ic Trays For Advanced Semiconductor Packaging And Complex Ic Modules

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Precision Jedec Ic Trays For Advanced Semiconductor Packaging And Complex Ic Modules

Brand Name : Hiner-pack

Model Number : HN24223

Certification : ROHS, ISO

Place of Origin : China

MOQ : 500 pcs

Price : $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities）

Payment Terms : T/T

Supply Ability : 2000PCS/Day

Delivery Time : 10 workdays

Packaging Details : CARTON, PALLET

Tray Weight : Varies, Typically Up To 500 Grams Per Cavity

Color : Usually black or dark gray for ESD protection

Quality Assurance : Delivery Guarantee, Reliable Quality

Cavity Size : 3x3x0.92 mm

Incoterms : EXW, FOB, CIF, DDU, DDP

Mold Type : Injection

Reusable : Yes

Tray Shape : Rectangular

Clean Class : General And Ultrasonic Cleaning

Ic Type : BGA,QFP,QFN,LGA,PGA

Packing Level : Transport package

Flatness : Less than 0.76mm

Capacity : 14x35=490 PCS

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Precision Jedec Ic Trays For Advanced Semiconductor Packaging And Complex Ic Modules
Looking for reliable precision JEDEC IC trays for advanced semiconductor packaging? These high-quality JEDEC IC trays are specially made for complex IC module packaging applications.
These custom JEDEC trays feature finely processed high-precision cavities that fit complex IC structures very well. They meet standard JEDEC industry requirements and can be fully customized according to your chip design drawings.
They are widely compatible with modern semiconductor packaging processes, and perfectly meet the packaging needs of SiP modules, MEMS devices and various complex IC modules.
Key Features/ Benefits
  • Full customization based on chip drawing
  • High precision cavity for complex IC structures
  • Excellent anti-static performance
  • Fast mold development
Specifications
Brand Hiner-pack
Model HN24223
Material MPPO
Package Type JEDEC
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 322.6×135.9×7.62 mm
Cavity Size 3x3x0.92 mm
Matrix QTY 14x35=490 PCS
Warpage MAX 0.76mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
This MPPO high-temperature resistant JEDEC IC tray provides full protection for IC chips throughout production, testing, packaging and transportation processes. It features excellent ESD anti-static performance, making it extremely suitable for electrostatic-sensitive semiconductor devices.It is widely applied to these professional semiconductor scenarios:
  • High-temperature SiP system-in-package packaging processes
  • Precision MEMS micro-electro-mechanical device packaging & handling
  • Advanced high-density semiconductor module assembly
  • Fine Pitch IC chip packaging, testing and carrier storage
  • High temperature resistant semiconductor manufacturing workshops
Packaging & Shipping/ Services
JEDEC Matrix Trays are packaged in durable, anti-static materials with secure stacking and cushioning inserts. Customized packaging solutions are available upon request. All shipments are tracked and handled by trusted carriers for reliable worldwide delivery.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Professional engineering team
  • Stable supply for global semiconductor customers

Product Tags:

Custom JEDEC IC trays

      

JEDEC Tray for MEMS

      

SiP compatible JEDEC trays

      
Cheap Precision Jedec Ic Trays For Advanced Semiconductor Packaging And Complex Ic Modules for sale

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