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High Precision JEDEC Tray for Fine Pitch IC

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High Precision JEDEC Tray for Fine Pitch IC

Brand Name : Hiner-pack

Model Number : HN24239

Certification : ROHS, ISO

Place of Origin : China

MOQ : 500 pcs

Price : $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities）

Payment Terms : T/T

Supply Ability : 2000PCS/Day

Delivery Time : 10 workdays

Packaging Details : CARTON, PALLET

Tray Weight : Varies, Typically Up To 500 Grams Per Cavity

Color : Usually black or dark gray for ESD protection

Quality Assurance : Delivery Guarantee, Reliable Quality

Cavity Size : 14x22x1.96 mm

Incoterms : EXW, FOB, CIF, DDU, DDP

Mold Type : Injection

Reusable : Yes

Tray Shape : Rectangular

Clean Class : General And Ultrasonic Cleaning

Ic Type : BGA,QFP,QFN,LGA,PGA

Packing Level : Transport package

Flatness : Less than 0.76mm

Capacity : 6x11=66 PCS

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High Precision JEDEC Tray for Fine Pitch IC

Need a reliable carrier for your delicate fine pitch ICs? Our JEDEC trays are engineered for maximum protection and performance in semiconductor manufacturing.


When your ICs require precise positioning or have non-standard dimensions, we recommend a fully customized JEDEC tray tailored to your components. Our custom pocket designs optimize cavity spacing for smooth automated pick-and-place, maximize storage capacity per tray, and ensure your fine pitch ICs are securely held throughout production. This solution not only safeguards your sensitive semiconductors but also meets your packaging requirements with cost-effective, high-precision manufacturing.


A JEDEC tray is a critical carrier for fine pitch ICs, semiconductors, and electronic components, used for automated handling, inspection, transport, and long-term storage. Therefore, every pocket in our trays is precision-machined to match the exact dimensions of your specific ICs. ESD-safe material and strict flatness control ensure electrostatic protection and stable positioning, making customization the ideal packaging solution for high-precision semiconductor applications.

Key Features/ Benefits
  • High precision cavities for fine pitch IC (≤0.5 mm)
  • ESD safe with surface resistance 1E4–1E11 Ω
  • Compatible with automation handling systems
  • Fully customizable pockets
  • Durable material for long lifecycle
Specifications
Brand Hiner-pack
Model HN24239
Material ABS
Package Type JEDEC
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 322.6×135.9×7.62 mm
Cavity Size 14x22x1.96 mm
Matrix QTY 6x11=66 PCS
Warpage MAX 0.76mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
JEDEC trays are widely used for IC protection during manufacturing and transport, especially for ESD-sensitive devices
  • Fine pitch IC packaging (QFN, BGA, CSP)
  • Automated pick-and-place systems
  • Semiconductor inspection & testing
  • IC logistics and storage
Packaging & Shipping/ Services
Our high-precision JEDEC trays are packaged in durable, ESD-safe anti-static materials with secure interlocking stacking design and shock-absorbing cushioning inserts, ensuring maximum protection against physical damage, electrostatic discharge, and contamination during transit and storage.

All shipments are fully tracked and handled by trusted global logistics carriers, ensuring reliable, on-time worldwide delivery to your facility. We provide flexible shipping options to meet your urgent production needs, including expedited shipping for rush orders, and comprehensive shipping documentation to streamline customs clearance for international orders.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers

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